Printed electronics make possible a new world of applications with material properties never before imagined. The process developed at binder allows 3D surfaces to be directly functionalised in various ways.
We strive to break new ground in printing technology. The printing system developed at binder allows functional layers such as electrodes or conductor paths to be applied directly to three-dimensionally formed or structured surfaces. The process is suited to substrates like plastic, metal, glass, ceramic and many more.
Characterisation of printing pastes
The ITZ provides highly advanced means of analysis for our three core competencies: electronics, optics and printing processes.
In addition to laser applications like marking or cutting, the areas of activity of the ITZ include surface engraving through cold ablation. With femtosecond laser technology, burr-free engravings of up to 50µm line width can be produced.
The binder ITZ develops individual electronics solutions for your applications. Our portfolio ranges from transparent heating elements to printed electrodes for capacitive sensors and user interfaces to complex layering systems such as printed electroluminescent lamps.
Electronics development / bonding
In addition to printed components, the ITZ also offers bonding and electronics solutions. This allows the individual components to be optimally matched to each other as an overall system.